USA Africa Dialogue Series - Fwd: NIDOA | CYPRIAN EMEKA UZOH:NIGERIAN INVENTOR WITH 130 US PATENTS,COMPILED BY MOLLY UZOH

---------- Forwarded message ----------
From: <gdada@aol.com>
Date: 25 September 2010 15:27
Subject: Re: NIDOA | CYPRIAN EMEKA UZOH:NIGERIAN INVENTOR WITH 130 US PATENTS,COMPILED BY MOLLY UZOH
To: adaejiagamba1@aol.com, toyin.adepoju@googlemail.com, NIDOA@yahoogroups.com, NIgerianWorldForum@yahoogroups.com, imostatecongress@yahoogroups.com, WorldIgboCongress@yahoogroups.com, igboworldforum@yahoogroups.com, IgboEvents@yahoogroups.com, igbo_forum@yahoogroups.com, ORAUSA@yahoogroups.com

Congratulations,

 

The DATABASE of this type of Supper Professional Nigerian Group is what  NIDOA is building from now.

 

We know we have many talents out here in the Americas but we must find them and encourage many of them to work together collectively in reversing the rate of development of the great country of Nigeria particularly from next year, next five years, next 10 years and another 50 years after our sober reflection of the past 50 years. Vision 20/20 must be achieved if we agree that China and Dubai witnessed remarkable turnaround positively development wise in just past 20 years. Yes we can make it if most people will agree to work together.

 

Please let us hear from anybody that may know anybody that we may not know directly from our NIDOA Chapters.

 

Our web site is www.nidoamerica.org

 

Regards,

 

G. A. Dada

NIDOA-Chairman

773-531-5742

 

-----Original Message-----
From: Azuoma Anugom <adaejiagamba1@aol.com>
To: toyin.adepoju@googlemail.com; NIDOA@yahoogroups.com; NIgerianWorldForum@yahoogroups.com; imostatecongress@yahoogroups.com; WorldIgboCongress@yahoogroups.com; igboworldforum@yahoogroups.com; IgboEvents@yahoogroups.com; igbo_forum@yahoogroups.com; ORAUSA@yahoogroups.com
Sent: Fri, Sep 24, 2010 3:58 pm
Subject: NIDOA | CYPRIAN EMEKA UZOH:NIGERIAN INVENTOR WITH 130 US PATENTS,COMPILED BY MOLLY UZOH

 

Wow!! This is very interesting.  Thanks for sharing!!

Azuoma Anugom
~~Adaejiagamba

Life shrinks according to one's courage.  Dare to be remarkable.

-----Original Message-----
From: toyin adepoju <toyin.adepoju@googlemail.com>
Sent: Fri, Sep 24, 2010 12:35 pm
Subject: NIDOA | CYPRIAN EMEKA UZOH:NIGERIAN INVENTOR WITH 130 US PATENTS,COMPILED BY MOLLY UZOH

 

                                                                                                                  CYPRIAN EMEKA UZOH

                                                                                                         NIGERIAN INVENTOR WITH 130 PATENTS

                                                                                                                COMPILED BY MOLLY UZOH

 

 

Invention # 54 in the list earned him Inventor of the Year 2006 because the technology in question came alive in quite a number of industrial and consumer electronics including mobile phones, computers, cameras, camcorders, etc. Since Emeka was working for IBM Microelectronics Division during the invention, the patent technically belongs to IBM however, the plagues was still given to Emeka to keep because he is the key inventor and the award came along when he has already left IBM.

 

In general, Emeka has over 170 patents worldwide but he has only 130 issued in the United States and a few more that are pending approval in the US Patent and Trademark Office (USPTO). The ownership of Emeka's 130 patents span across IBM, ASM, NuTool, Nouvellus and  SolorPower.

 

                                                                           http://www.learningright.com/learningright/nigerian_inventors/

Check out: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.htm&r=0&p=1&f=S&l=50&Query=IN%2Fuzoh+AND+Cyprian&d=PTXT
Cyprian Emeka Uzoh     Invention # 54 in the list earned him Inventor of the Year 2006 because the technology in question came alive in quite a number of industrial and consumer electronics including mobile phones, computers, cameras, camcorders, etc. Since Emeka was working for IBM Microelectronics Division during the invention, the patent technically belongs to IBM however, the plagues was still given to Emeka to keep because he is the key inventor and the award came along when he has already left IBM.   In general, Emeka has over 170 patents worldwide but he has only 130 issued in the United States and a few more that are pending approval in the US Patent and Trademark Office (USPTO). The ownership of Emeka's 130 patents span across IBM, ASM, NuTool, Nouvellus and  SolorPower.		PAT. NO. Title   1 7,704,880 Method of forming contact layers on substrates   2 7,670,473 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same   3 RE40,983 Method to plate C4 to copper stud   4 7,572,354 Electrochemical processing of conductive surface   5 7,503,830 Apparatus for reduction of defects in wet processed layers   6 7,491,308 Method of making rolling electrical contact to wafer front surface   7 7,476,304 Apparatus for processing surface of workpiece with small electrodes and surface contacts   8 7,456,501 Semiconductor structure having recess with conductive metal   9 7,416,975 Method of forming contact layers on substrates   10 7,378,004 Pad designs and structures for a versatile materials processing apparatus   11 7,329,335 Device providing electrical contact to the surface of a semiconductor workpiece during processing   12 7,311,811 Device providing electrical contact to the surface of a semiconductor workpiece during processing   13 7,309,413 Providing electrical contact to the surface of a semiconductor workpiece during processing   14 7,309,406 Method and apparatus for plating and polishing semiconductor substrate   15 7,282,124 Device providing electrical contact to the surface of a semiconductor workpiece during processing   16 7,250,104 Method and system for optically enhanced metal planarization   17 7,244,347 Method and system to provide electrical contacts for electrotreating processes   18 7,238,092 Low-force electrochemical mechanical processing method and apparatus   19 7,211,174 Method and system to provide electrical contacts for electrotreating processes   20 7,204,917 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same   21 7,201,829 Mask plate design   22 7,195,700 Method of electroplating copper layers with flat topography   23 7,195,696 Electrode assembly for electrochemical processing of workpiece   24 7,189,146 Method for reduction of defects in wet processed layers   25 7,147,766 Chip interconnect and packaging deposition methods and structures   26 7,122,473 Edge and bevel cleaning process and system   27 7,115,510 Method for electrochemically processing a workpiece   28 7,097,755 Electrochemical mechanical processing with advancible sweeper   29 6,979,393 Method for plating copper conductors and devices formed   30 6,974,769 Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization   31 6,969,456 Method of using vertically configured chamber used for multiple processes   32 6,946,716 Electroplated interconnection structures on integrated circuit chips   33 6,946,066 Multi step electrodeposition process for reducing defects and minimizing film thickness   34 6,943,112 Defect-free thin and planar film processing   35 6,942,780 Method and apparatus for processing a substrate with minimal edge exclusion   36 6,936,154 Planarity detection methods and apparatus for electrochemical mechanical processing systems   37 6,932,896 Method and apparatus for avoiding particle accumulation in electrodeposition   38 6,905,588 Packaging deposition methods   39 6,884,334 Vertically configured chamber used for multiple processes   40 6,867,136 Method for electrochemically processing a workpiece   41 6,866,763 Method and system monitoring and controlling film thickness profile during plating and electroetching   42 6,861,354 Method and structure to reduce defects in integrated circuits and substrates   43 6,852,630 Electroetching process and system   44 6,852,208 Method and apparatus for full surface electrotreating of a wafer   45 6,837,979 Method and apparatus for depositing and controlling the texture of a thin film   46 6,821,409 Electroetching methods and systems using chemical and mechanical influence   47 6,815,354 Method and structure for thru-mask contact electrodeposition   48 6,797,132 Apparatus for plating and polishing a semiconductor workpiece   49 6,780,772 Method and system to provide electroplanarization of a workpiece with a conducting material layer   50 6,777,338 Edge and bevel cleaning process and system 51 6,773,576 Anode assembly for plating and planarizing a conductive layer 52 6,768,203 Open-bottomed via liner structure and method for fabricating same 53 6,716,084 Carrier head for holding a wafer and allowing processing on a front face thereof to occur 54 6,709,562 Method of making electroplated interconnection structures on integrated circuit chips 55 6,695,962 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs 56 6,692,588 Method and apparatus for simultaneously cleaning and annealing a workpiece 57 6,685,814 Method for enhancing the uniformity of electrodeposition or electroetching 58 6,666,959 Semiconductor workpiece proximity plating methods and apparatus 59 6,649,523 Method and system to provide material removal and planarization employing a reactive pad 60 6,630,059 Workpeice proximity plating apparatus 61 6,612,915 Work piece carrier head for plating and polishing 62 6,610,190 Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate 63 6,600,230 Seedlayer for plating metal in deep submicron structures 64 6,582,579 Methods for repairing defects on a semiconductor substrate 65 6,572,982 Electromigration-resistant copper microstructure 66 6,569,783 Graded composition diffusion barriers for chip wiring applications 67 6,497,800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating 68 6,492,262 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies 69 6,482,307 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing 70 6,478,936 Anode assembly for plating and planarizing a conductive layer 71 6,465,376 Method and structure for improving electromigration of chip interconnects 72 6,437,440 Thin film metal barrier for electrical interconnections 73 6,429,519 Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries 74 6,413,854 Method to build multi level structure 75 6,413,403 Method and apparatus employing pad designs and structures with improved fluid distribution 76 6,413,388 Pad designs and structures for a versatile materials processing apparatus 77 6,409,904 Method and apparatus for depositing and controlling the texture of a thin film 78 6,406,608 Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal 79 6,399,496 Copper interconnection structure incorporating a metal seed layer 80 6,380,628 Microstructure liner having improved adhesion 81 6,372,081 Process to prevent copper contamination of semiconductor fabs 82 6,355,153 Chip interconnect and packaging deposition methods and structures 83 6,354,916 Modified plating solution for plating and planarization and process utilizing same 84 6,352,623 Vertically configured chamber used for multiple processes 85 6,344,129 Method for plating copper conductors and devices formed 86 6,339,258 Low resistivity tantalum 87 6,337,218 Method to test devices on high performance ULSI wafers 88 6,337,151 Graded composition diffusion barriers for chip wiring applications 89 6,333,560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies 90 6,333,120 Method for controlling the texture and microstructure of plated copper and plated structure 91 6,331,237 Method of improving contact reliability for electroplating 92 6,328,872 Method and apparatus for plating and polishing a semiconductor substrate 93 6,297,140 Method to plate C4 to copper stud 94 6,291,885 Thin metal barrier for electrical interconnections 95 6,274,935 Copper wire-bonding pad 96 6,270,646 Electroplating apparatus and method using a compressible contact 97 6,261,426 Method and apparatus for enhancing the uniformity of electrodeposition or electroetching 98 6,258,717 Method to produce high quality metal fill in deep submicron vias and lines 99 6,258,707 Triple damascence tungsten-copper interconnect structure 100 6,251,528 Method to plate C4 to copper stud   101 6,251,251 Anode design for semiconductor deposition 102 6,235,406 Copper film including laminated impurities 103 6,234,870 Serial intelligent electro-chemical-mechanical wafer processor 104 6,228,231 Electroplating workpiece fixture having liquid gap spacer 105 6,217,734 Electroplating electrical contacts 106 6,193,861 Apparatus and method to enhance hole fill in sub-micron plating 107 6,181,012 Copper interconnection structure incorporating a metal seed layer 108 6,180,505 Process for forming a copper-containing film 109 6,168,693 Apparatus for controlling the uniformity of an electroplated workpiece 110 6,140,234 Method to selectively fill recesses with conductive metal 111 6,126,806 Enhancing copper electromigration resistance with indium and oxygen lamination 112 6,123,825 Electromigration-resistant copper microstructure and process of making 113 6,117,784 Process for integrated circuit wiring 114 6,114,937 Integrated circuit spiral inductor 115 6,113,769 Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal 116 6,113,759 Anode design for semiconductor deposition having novel electrical contact assembly 117 6,103,096 Apparatus and method for the electrochemical etching of a wafer 118 6,090,710 Method of making copper alloys for chip and package interconnections 119 6,071,388 Electroplating workpiece fixture having liquid gap spacer 120 6,066,030 Electroetch and chemical mechanical polishing equipment 121 6,063,506 Copper alloys for chip and package interconnections 122 6,056,869 Wafer edge deplater for chemical mechanical polishing of substrates 123 6,054,329 Method of forming an integrated circuit spiral inductor with ferromagnetic liner 124 5,933,753 Open-bottomed via liner structure and method for fabricating same 125 5,930,669 Continuous highly conductive metal wiring structures and method for fabricating the same 126 5,911,619 Apparatus for electrochemical mechanical planarization 127 5,884,990 Integrated circuit inductor 128 5,807,165 Method of electrochemical mechanical planarization 129 5,793,272 Integrated circuit toroidal inductor 130 5,755,859 Cobalt-tin alloys and their applications for devices, chip interconnections and packaging

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